Thermalpad
Below we show an example of a subtle yet critical part of a multilayerMultilayer (Mehrschicht-Technologie):Die Multilayer-Technolo… More design problem.
Insulation pads that are too large (red) cause an interruption of the surface in the inner layer (black). Different areas of “equal” potential are created. The connection via the thermal drops is inadequate due to the width of the dividing line.
- Inadequate electrical functionality due to incorrect design
- Poor solderability due to misdirected heat dissipation
Optimizations
Minimum modification
Reducing the surface insulation (plane clearance)
on the pads to achieve a connection.
- Compliance with the
netlist is reached again
Recommended amendment
Reduce the separator line width.
- Optimum flow around the
thermal pad is made possible