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Summary of the most important characteristics

General

Value/tolerance
Material thickness Tolerance ±10%
Final diameter plated-through hole ±75μm
Final diameter of non-plated-through hole ±50μm
Galvanic copper plating min. 20μm, according to IPC class 3: min. 25µm
Minimum hole drilled mechanically 0,15mm
Microvia mechanically or laser drilled 0,10mm
Min. Restring 0,05mm
Aspect ratio standard holes 8:1 (max. 13:1)
Aspect Ratio Blindvias 1:1
Positioning accuracy of the holes ±0,05mm
Position accuracy contour ±0,15mm
Trackwidth ±0,05mm bzw. ±20%

Additional prints

Value/tolerance
Solder mask thickness min. 12μm
Structure width for solder resist min. 50μm
Position accuracy solder mask ±0,10mm
Structure size legendprint min. 150μm (clipped at the copper pads)
Position accuracy legendprint ±0,10mm
Structure width for peelable min. Fläche Ø 2mm
Position accuracy peelable/carbon ±0,20mm

Surface finishes

Value/tolerance
HAL SnPb (leaded, not RoHS conform) Thickness 2-50μm, ca.63 % Sn + 37% Pb
HAL leadfree Thickness 2-50μm, ca. 99,9% Sn + 0,1% Pb
Chem. Ni/Au (ENIG) 4-7μm Ni + min. 0,01μm Au
Chem. Ni/Pd/Au (ENEPIG) 4-7μm Ni + 0,2 μm Pd + min. 0,01μm Au
Chem. Sn (Tin) Min. 0,7μm Sn
Chem. Ag (Silver) Min. 0,07μm Ag
Edgeconnector (electroplated hard gold plating) 4-7μm Ni + min. 0,8μm Au

Mechanics

Value/tolerance
Nominal dimensions 0,5 to 6,0mm ±0,1mm
Nominal dimensions >6,0mm ±0,2mm
Radius and chamfers ±0,20mm
Chamfering connector area 45° or 20°
Countersink PTH and NPTH, 90° sink tool
Routing tool Standard Ø 2.4mm or 2.0mm
Min. routing width min. Ø 0,8mm (results in 0.9-1.0mm after PTH)
Scoring 30° ± 1° (Thckness from 0.5mm to 2.4mm)
Offset single scoring ±0,025mm
Offset break edge after separation ±0,15mm
Hole pattern ±0,10 mm
Hole pattern to contour ±0,15 mm
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