Each printed circuit boardauch: gedruckte Schaltung, engl.: PCB – Printed circuit boar… More is manufactured individually to order. Production is based on a broad spectrum of knowledge from the fields of photography, electronics, mechanics, chemistry, metallurgy and electroplating. It requires the use of highly developed software, the use of various specific processes and the use of many different materials: from laminates to resins, from light-sensitive films to various metal alloys. Depending on its complexity and properties, the production of a printed circuit boardauch: gedruckte Schaltung, engl.: PCB – Printed circuit boar… More can involve up to 30 different processes and work phases.
Our intention in creating these guidelines was to provide developers and designers with a technical basis for the selection of various design features. These not only have an impact on the cost of the PCBauch: gedruckte Schaltung, engl.: PCB – Printed circuit boar… More, but also on the level of complexity and reliability.
PCBauch: gedruckte Schaltung, engl.: PCB – Printed circuit boar… More materials, properties and surfaces were sorted according to criticality on a scale from green to red.
The manufacturing processes are becoming more complex and intensive and the materials used are becoming correspondingly more expensive.
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simple & affordable |
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Complex & expensive |
| Base material | |
|---|---|
| FR4 Tg130/135 |
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| CEM1 |
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| AL upto 1,2W/mK |
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| CEM3 |
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| FR4 Tg 150 |
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| FR4 Tg 170/180 |
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| AL upto 2,0W/mK |
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| Defined layer stackup |
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| Defined base material |
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| Halogen free |
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| High CTI value (>249V)* |
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| CEM3 HTC (DSPTH)* |
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| Flexible PCB |
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| AL above 2,0W/mK |
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| High thermal conductivity |
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| Rigidflex PCB |
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| Drilling | |
|---|---|
| Vias from 0,25 to 1,0mm |
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| Through holes from 0,30 to 3,35mm |
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| NPTH from 0,35 to 2,90mm |
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| Restring at vias > 5mil* |
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| Restring at drill holes > 6mil* |
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| Aspect Ratio at vias < 6,4:1 |
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| Vias with Ø ≥ 0,2mm |
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| NPTH from 2,95 to 4,95mm |
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| Via restring 4mil-4,99mil* |
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| Restring 5mil-5,99mil * |
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| Aspect Ratio Vias 6,4:1 - 10,6:1 |
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| Plated edheholes > 0,85mm |
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| Microvias 0,1mm to 0,15mm |
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| NPTH > 4,95mm |
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| Via restring 3,4mil-3,99mil* |
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| Restring 4,4mil-4,99mil* |
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| Aspect Ratio 10,6:1 - 16:1 |
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| Edgeholes PTH 0,65-0,8mm |
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| Hole density 600-1000/dm² |
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| AR at Blind Vias < 1:2 |
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| Tolerances < ±0,1mm* |
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| Microvias < 0,1mm |
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| Laser Microvias < 0,05mm |
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| Via restrings < 3,4mil* |
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| Restrings <4,4mil* |
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| AR* at Vias > 16:1 |
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| Edgeholes PTH <0,65mm |
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| Hole density >1000/dm² |
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| AR* at Blind Vias >0,5:1 |
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| Tolerances < ±0,15mm* |
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| Buried Vias* |
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| Mechanics | |
|---|---|
| Routing > 1,2mm |
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| Drill tolerances ±0,15mm |
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| PT slots >1.05mm |
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| Scoring both sides |
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| Routing 1,0 - 1,2mm |
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| Routing tol.±0,1mm |
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| PT slots 0,8 - 1mm |
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| PT halfholes >1,05mm |
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| Routing 0,8 - 0,9mm |
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| PT slots 0,65 - 0,7mm |
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| Scoring onesided |
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| PT slots 0,85 - 1,0mm |
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| Z-axis routing |
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| High Volume routing |
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| Micro routing <= 0,6mm |
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| PT slots 0,45 - 0,6mm |
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| PT halfholes 0,6 - 0,8mm |
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| routing tol.< ±0,1mm |
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| Jumpscoring |
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| Countersink |
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All figures refer to the finished dimensions
| PCB type | |
|---|---|
| Layers 1 - 8 |
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| Technology >=125um* |
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| Thickness 0,8 - 3,2mm |
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| Odd number of layers (>=3) |
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| Thickness 0,4 - 0,6mm |
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| Size >600mm (onesided) |
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| Impedance control |
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| Peelable / carbon printing |
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| Thickness 3,2-5mm |
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| 10-18 layers |
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| AL 2 layers |
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| Thickness <0,4mm |
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| Technology >100um* |
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| Micro-PCB (individual) |
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| Electroplated several times |
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| Capton tape application |
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| IPC Class 3 |
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| SBU |
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| >20 layers |
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| AL Multilayer |
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| dimension >540mm (>2 lyrs) |
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| hard gold |
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| Thick copper or via sleeve |
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| Peelable at hole >3mm |
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| Thickness >5mm |
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All data related to base Cu 35µm
| Solder stop/viafilling | |
|---|---|
| SM green (no specification) |
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| SM other base colors |
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| SM bridges ≤0,5mm |
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| Legendprint standard |
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| Via-Filling with SM |
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| Overprinted with SM |
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| Via-Filling with Resin |
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| SM special colors |
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| Legend special color |
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| Via-Filling Type VII* |
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All data related to base Cu 35µm
| Quality/Reports | |
|---|---|
| Mikrosection Micrograph |
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| Control according to IPC class 2 |
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| Microsection with report |
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| EMPB/FAR/FAI/FQC/COC |
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| PPAP/IMDS |
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| Feasibility studies |
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| Measurement protocol 3D |
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| Control according to IPC class 3 |
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