HDI printed circuit boards, short for High-Density Interconnect, are innovative and highly complex printed circuit boards that enable a high packing density of electronic components. These boards use advanced techniques such as microfine traces, multilayerMultilayer (Mehrschicht-Technologie):Die Multilayer-Technolo… More structures and ultra-fine vias to offer improved performance in a more compact design. The HDI process enables a higher number of connections between components, resulting in more efficient and powerful electronic devices. These boards are ideal for applications in areas such as mobile devices, medical technology, aerospace and other high-tech industries where space optimization and increased performance are crucial.

According to IPC-2226, 3 HDI structures are defined: